By Christian M. Val (auth.), W. Kinzy Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui (eds.)
Multi-chip modules (MCMs) with excessive wiring density, managed impedance interconnects, and thermal administration potential have lately been constructed to deal with the issues posed via advances in digital platforms that make calls for for larger speeds and complexity.
MCM-C/Mixed applied sciences and Thick movie Sensors highlights contemporary advances in MCM-C know-how. advancements in fabrics and methods that have ended in elevated interconnection density are reviewed: finer solution thick movie inks, excessive performance-low temperature dielectric tapes, precision through new release by way of either laser and mechanical equipment, and greater display printing applied sciences have given us function answer to the 50 mum line/space point. Thermal administration has drastically benefitted from such new fabrics as cofire AIN and diamond.
MCM-C expertise is appropriate with thick movie sensors, and paintings is reviewed on environmental fuel sensors, strain and temperature sensors, and the improvement of novel fabrics during this zone.
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Extra resources for MCM C/Mixed Technologies and Thick Film Sensors
1993) Dendritic Growth from Dielectric Constituents: a Newly Discovered Failure Mechanism in Thick Film ICs? Int. J. , 207-216. 8. Harsanyi, G. (1992) New Type Short Circuits at Fritless Thick Film Conductors - Formed from Reduced Oxides, Intern. Symp. on Microelectronics, ISHM, San Francisco, 140-143. 9. Jr. (1993) Moisture Removal From Hybrid Electronic Components and Assemblies, Intern. Symp. on Microelectronics. ISHM. Dallas, 104-107. 10. R. (1986) Hybrid Hermeticity and Failure Analysis, Hybrid Circuit Technology, April 1986, 19-24.
Ripka, G. and Harsanyi, G. (1985) Electrochemical Migration in ThickFilm ICs, Electrocomp. Sci. , 11, 281-290. 6. V. E. (1981) Silver Migration in Thick Film Conductors and Chip Attachment Resins, MicroelectronicsJournal, 4, 2329. 7. Harsanyi, G. (1993) Dendritic Growth from Dielectric Constituents: a Newly Discovered Failure Mechanism in Thick Film ICs? Int. J. , 207-216. 8. Harsanyi, G. (1992) New Type Short Circuits at Fritless Thick Film Conductors - Formed from Reduced Oxides, Intern. Symp.
2. Experimental design In order to investigate the high frequency properties of the low temperature cofired tape as a substrate material, a test circuit was designed. 5 GHz was designed with different substrate materials. The amplifier circuit consists of 2 GaAs FETs, 2 resistors and 7 capacitors. The test circuit does also contain a 50 ohm microstrip of 40 mm length. The test circuit comes in two alternatives (Fig I). The first one, called "normal", has all the circuitry in one single layer on top of the substrate with the backside as a ground layer.