Microstrip Lines and Slotlines, Third Edition by Ramesh Garg

By Ramesh Garg

Because the moment version of this publication was once released in 1996, planar transmission line expertise has improved significantly because of advancements in ultrawideband (UWB) communications, imaging, and RFID functions. furthermore, the simultaneous calls for for compactness of instant digital units whereas assembly stronger functionality requisites, necessitates elevated use of computer-aided layout, simulation, and research by means of microwave engineers. This ebook is written to assist engineers effectively meet those challenges.

Details comprise the improvement of governing equations, foundation features, Green’s functionality and usual effects. greater than 1200 equations complement the textual content. certain recognition is given to using simulation software program within the layout of advanced units and figuring out the relationship among information accrued from simulation software program and the particular layout process.

The e-book is essentially meant for microwave layout engineers and R&D experts who have to hire planar transmission traces in designing dispensed circuits and antenna platforms for quite a lot of instant functions. complex undergraduate and graduate scholars in electronics and telecommunication engineering also will welcome this addition for your library.

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Additional info for Microstrip Lines and Slotlines, Third Edition

Example text

In-line design and simple fabrication; 4. Adaptability to different substrate thicknesses. The design of these transitions consists of two parts: mechanical design to match physically both electrical and magnetic field distributions between the two media as close as possible in order to keep the discontinuity reactances small, and the electrical design to match the impedances and any other interface discontinuity reactances over the operating frequency range to minimize losses. Generally, fields are matched by shaping the structure, and the impedance matching and discontinuity reactance compensation are realized by using l/4 transformers or tapered sections.

By measuring the resonant frequency of the two resonators, end effects can be canceled. technique. The substrates are stacked and laminated under heat and pressure to make a monolithic board. Next, via holes are drilled in the board to make interlayer metallic connections and are catalyzed; the whole board is plated with electroless copper. This increases the thickness of the surface conductor pattern and provides the copper layer in the via holes. The board is then tinned for soldering, or nickel or gold plated for gold wire bonding.

There is a fairly good agreement between the measured results and theoretical values. 6 Some Comments The aforementioned models assume an open microstrip line on a nonmagnetic substrate (mr = 1) and that the thickness effect is included in the quasi-static value ere (0). Atwater [48] and Edwards [6] reported dispersion data comparison for several microstrip lines using many dispersion models. York and Compton [51] provided a comparison between the measured data and the several above-described dispersion models up to 18 GHz for several substrate thicknesses.

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